Characterization of Inkjet-Printed Silver Patterns for Application to Printed Circuit Board (PCB)

Abstract

In this paper, we describe the analysis of inkjet-printed silver (Ag) patterns on epoxy-coated substrates according to several reliability evaluation test method guidelines for conventional printed circuit boards (PCB). To prepare patterns for the reliability analysis, various regular test patterns were created by Ag inkjet printing on flame retardant 4 (FR4) and polyimide (PI) substrates coated with epoxy for each test method. We coated the substrates with an epoxy primer layer to control the surface energy during printing of the patterns. The contact angle of the ink to the coated epoxy primer was <TEX>$69^{\circ}$</TEX>, and its surface energy was 18.6 <TEX>$mJ/m^2$</TEX>. Also, the substrate temperature was set at <TEX>$70^{\circ}C$</TEX>. We were able to obtain continuous line patterns by inkjet printing with a droplet spacing of <TEX>$60{\mu}m$</TEX>. The reliability evaluation tests included the dielectric withstanding voltage, adhesive strength, thermal shock, pressure cooker, bending, uniformity of line-width and spacing, and high-frequency transmission loss tests.