Wavelength‐Property Correlation in Electrodeposited Ultrastructured Cu‐Ni Multilayers

Abstract

Multilayered foils with 10% Cu‐90% Ni and ultrathin (9–2000Aå) layers have been fabricated by electrodeposition. The anodic passivity of Ni and the irreversibility of the Ni/Ni2+ reaction permit alternate deposition of each metal layer from a common electrolyte. SEM, TEM, and x‐ray diffraction analysis indicate discrete layer formation and a (100) textured structure. A maximum in the tensile strength and electrical resistivity of these foils was detected at a wavelength of 200Aå . The maximum tensile strength obtained (1900 MPa) is over 3 and 4.5 times greater than that for homogeneous Ni and Cu foils and exceeds the maximum value reported for vacuum deposited foils by 70%.