Publication | Closed Access
Ammonothermal Epitaxy of Thick GaN Film Using NH<sub>4</sub>Cl Mineralizer
71
Citations
11
References
2006
Year
Materials EngineeringMaterials ScienceSingle-crystalline Gan FilmsEpitaxial GrowthEngineeringAmmonothermal EpitaxySurface ScienceApplied PhysicsAluminum Gallium NitrideGan Power DeviceMetallic GaThin FilmsCategoryiii-v SemiconductorGa/gan PrecursorChemical Vapor Deposition
Single-crystalline GaN films of ≤ 110 µm in thickness have been fabricated on hydride vapor phase-grown (0001) GaN substrates by employing a relatively low-pressure (≤170 MPa) ammonothermal growth method with NH4Cl as mineralizer. Metallic Ga and polycrystalline GaN has been the chosen precursor. An average growth speed on the (0001) face of the substrate of ≥5 µm/day was observed when using metallic Ga and about 7 µm/day for GaN. The maximum growth speed of 27.5 µm/day was achieved for the film grown at a supersaturation from a combined Ga/GaN precursor. The surface morphology is not affected by the nature of the precursor.
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