IEEE Microwave and Wireless Components Letters · 2013 · 10 citations · 8 references
EngineeringElectrical EngineeringAnalog ElectronicsMicroelectronicsSemiconductor DevicesCmos Circuit DesignHigh-frequency Power ConversionHigh-frequency Semiconductor DevicesIntegrated Circuit DesignPower AmplifiersRadio-frequency Integrated CircuitsCapacitanceClass E AmplifiersClass E Power AmplifiersHigh-efficiency Power AmplifiersPower Added EfficiencyPower Amplifier DesignPower EfficiencyRadio Frequency Power Amplifiers
This letter presents a fully integrated triple-band CMOS class-E power amplifier (PA) for the 0.8/1.9/2.4 GHz frequencies. The operating frequency band is tuned by a power cell resizing technique and by changing the supply bias position with a multi-tap transformer for the required capacitance and inductance values for optimum class-E operation. The PA achieves output powers of 28/29.6/26.5 dBm and power-added efficiency of 40/45/37% at each frequency band. The PA is implemented in a 0.18 μm CMOS process without multiple transformers or input/output matching networks. The total chip size is 1.5 × 1.5 mm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> .
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