2009 · 26 citations · 5 references
EngineeringElectrical EngineeringAntennasMicroelectronicsMicrowave EngineeringImpedance MatchingImpedance Matching CircuitsIntegrated Circuit DesignPower AmplifiersRadio-frequency Integrated CircuitsRf MemsClass E AmplifiersClass E Power AmplifiersPower Amplifier DesignPower OutputRadio Frequency Power AmplifiersReconfigurable Impedance MatchingReconfigurable Matching NetworksRf Mems Impedance Matching Networks
In this work we present a reconfigurable mid-power Class-E Power Amplifier (PA) [1,2] operating at ~900MHz and ~1800MHz (GSM standard [3]) realized hybridizing one chip manufactured in AMS 0.35 μm CMOS technology and one MEMS sub-network. The CMOS chip realizes the active part of the circuit, whereas the MEMS block (realized in FBK technology) implements a reconfigurable impedance Matching Network (MN) that transforms the 50Ω antenna load to the 12Ω impedance required by the PA in order to deliver 20dBm output power in both the GSM operating frequency bands. The prototype of the MEMS/CMOS PA we realized delivers 20dBm with 38% and 26% drain efficiencies at 900MHz and 1800MHz, respectively, demonstrating to be a feasible option compared to standard commercial solutions.
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A Fully Integrated Quad-Band GSM/GPRS CMOS Power Amplifier
Ichiro Aoki, S. Kee, R. Magoon et al. · 2008 · 117 citations
A 1.7-GHz 31dBm differential CMOS Class-E Power Amplifier with 58% PAE
Riccardo Brama, Luca Larcher, Andrea Mazzanti et al. · 2007 · 16 citations · Full text