TWO CRACK GROWTHS IN A FUNCTIONALLY GRADED PLATE UNDER THERMAL SHOCK

Abstract

This article examines the problem of two thermal cracks under a transient temperature field in a ceramic/metal functionally graded plate. When the functionally graded plate is subjected to thermal shock, multiple cracks often occur on the ceramic surface. It is shown that the crack paths are influenced by interaction between multiple cracks and a compositional profile of the functionally graded plate. Transient thermal stresses are treated as a linear quasi-static thermoelastic problem for a plane strain state. The crack paths of two cracks are obtained using the finite element method with mode I and mode II stress intensity factors.