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The effect of header shapes on the flow distribution in a manifold for electronic packaging applications

Header ShapesEngineeringElectronic Packaging ApplicationsFlow DistributionChip-scale PackageAdvanced Packaging (Semiconductors)Fluid MechanicsMechanical EngineeringDisperse FlowTransport PhenomenaRheologyGas-liquid FlowMultiphase FlowElectronic Packaging3D Printing