Concepedia

Publication | Closed Access

Creep and thermomechanical fatigue properties of in situ Cu6Sn5 reinforced lead-free composite solder

DOI

28

Citations

13

References

2010

Year

Feng Tai, Fu Guo, Moyan Han, Zhuoyang Xia, Yongping Lei, Yao Shi
Materials Science and Engineering A

References

YearCitations

Page 1