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Effect of transient liquid phase (TLP) bonding on the ductility of a Ni-base single crystal superalloy in a stress rupture test

Materials ScienceEngineeringSevere Plastic DeformationSuperalloyMechanical EngineeringStress Rupture TestMicrostructure-strength RelationshipResidual StressWork HardeningTransient Liquid PhaseMechanics Of MaterialsMicrostructure