Computer Simulation of Solder Bridging Phenomena

Abstract

Solder bridging is investigated under the assumption that liquid solder bridges are equilibrium capillary surfaces and that the principal factor that determines whether a bridge will freeze to form a permanent short is its configurational stability. A computational parametric bridge stability study is conducted to determine the response of bridging to the system volume, the distance between pads, the contact angle between the liquid metal and resist surface and the relevant physicochemical properties of the liquid metal.