The Journal of Chemical Physics · 1970 · 202 citations · 9 references
Natural SciencesPhysicsChemical KineticsPhysical ChemistryPlasma PhysicsElectron Transfer ReactionsHigh-temperature PlasmasElectron AttachmentElectron Attachment ProcessesElectron Transfer RatesMolecular Attachment KineticsRate Constant DeterminationReaction Kinetics In Low TemperaturesTemperature Dependence Of RatesTemperature-dependent Reaction Rate
The attachment rate for electrons to SF6 has been measured between 293 and 523°K in a helium-buffered flowing afterglow over the pressure range of 0.1–1.5 torr. The attachment has a rate constant of 2.2 × 10−7 cm3/sec, independent of temperature and pressure. The primary reaction product over the measured range of temperatures is SF6−. However, the rate of production of SF5− increases rapidly with temperature.
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