Publication | Closed Access
Electrodeposition of CoMoP thin film as diffusion barrier layer for ULSI applications
24
Citations
42
References
2009
Year
Materials ScienceDiffusion Barrier LayerEngineeringSurface ScienceApplied PhysicsComop Thin FilmSemiconductor MaterialElectronic PackagingThin FilmsMicroelectronicsChemical DepositionChemical Vapor DepositionThin Film ProcessingUlsi Applications
| Year | Citations | |
|---|---|---|
Page 1
Page 1