Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 2002 · 16 citations · 0 references
Natural SciencesMaterials EngineeringMaterials ScienceCrystal StructureElectronic MaterialsOptical MaterialsFracture MechanicsLaser PhysicsRadiation Damage In MaterialsRare-earth-doped MaterialsDamage ThresholdsExcimer LasersLasersNd:yag Laser TreatmentThermal Fracture MechanicsThermal ShockThermal Shock FractureThermal Stress Fracture
In this paper we present the results of damage tests performed at 1064 and 355-nm at 8-10 ns on conventional and rapid growth DKDP tripler crystals. The crystals were laser conditioned prior to damage testing by raster scanning using either Nd:YAG (1064 and 355 nm, 8-10 ns) or excimer lasers at 248, 308 or 351 nm with pulse durations of approximately 30-47 ns. The results show that it is possible to attain increases in 355-nm damage probability fluences of 2X for excimer conditioning at 248 and 308 nm. However, these wavelengths can induce absorption sufficient to induce bulk fracture by thermal shock when impurities such as arsenic, rubidium and sulfur are present in the crystals in sufficient quantity. Tests to evaluate the efficiency of 351-nm conditioning (XeF excimer) show improvements of 2X and that thermal fracture by induced absorption is not a problem. We also discuss our recent discovery that low fluence raster scanning at UV wavelengths leads to 1064-nm damage thresholds of over 100 J/cm<SUP>2</SUP> (10-ns pulses).