Concepedia

Thermal and mechanical analysis of delamination in GaN-based light-emitting diode packages

Jianzheng Hu, Lianqiao Yang, Woong Joon Hwang, Moo Whan Shin

Journal of Crystal Growth · 2006 · 78 citations · 4 references

Concepts

EngineeringElectrical EngineeringMaterials EngineeringSemiconductor DevicesSemiconductor MaterialsThermal AnalysisIii-v SemiconductorsLight-emitting DiodesSemiconductor ReliabilityThermal Properties Of SemiconductorsWide Band Gap SemiconductorsWide-bandgap SemiconductorsDevice PackagingGallium Nitride (Gan) MaterialsGallium Nitride Light-emitting DiodesGallium Nitride Power DevicesMechanical Failure Analysis

References

4

Fine structure of heat flow path in semiconductor devices: A measurement and identification method

Vladimı́r Székely, Tran Van Bien · Solid-State Electronics · 1988 · 437 citations

Engineering, Electrical Engineering, Materials Science +17

A new evaluation method of thermal transient measurement results

V. Székely · Microelectronics Journal · 1997 · 432 citations

Engineering, Computer Engineering, Heat Transfer +16

Thermally induced IC package cracking

D. Suhl · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1990 · 32 citations

Engineering, Materials Engineering, Materials Science +17

Investigation of the adhesion strength between molding compound and leadframe at higher temperatures

Roland Schmidt, P. Alpern, K. Plecher et al. · 2002 · 15 citations

Natural Sciences, Materials Engineering, Materials Science +17