Thermal and mechanical analysis of delamination in GaN-based light-emitting diode packages - Concepedia

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Thermal and mechanical analysis of delamination in GaN-based light-emitting diode packages

78

Citations

4

References

2006

Year

Jianzheng Hu, Lianqiao Yang, Woong Joon Hwang, Moo Whan Shin

Journal of Crystal Growth

Wide-bandgap SemiconductorElectrical EngineeringSolid-state LightingEngineeringMechanical AnalysisApplied PhysicsAluminum Gallium NitrideGan Power DeviceElectronic PackagingCategoryiii-v SemiconductorOptoelectronics

References

	Year	Citations

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