Applied Physics Letters · 2004 · 14 citations · 17 references
EngineeringMaterials EngineeringMaterials ScienceOptoelectronicsSemiconductor DevicesSemiconductor MaterialsLight-emitting DiodesSemiconductor Device MaterialsSemiconductor PhysicsWide Band Gap SemiconductorsWide-bandgap Semiconductor DevicesWide-bandgap SemiconductorsAnnealingGallium NitrideOhmic ContactsResistivityResistivity MeasurementSecondary Ion Mass SpectrometryThermal TreatmentUltraviolet Light-emitting Diodes
Thermal stability, optical reflectivity, and contact resistivity of Pd∕Ni∕Al∕Ti∕Au ohmic contacts to p-type GaN were investigated. In contrast to its Pd∕Al∕Ti∕Au counterparts, Pd∕Ni∕Al∕Ti∕Au contacts retained their specific contact resistivity (<2×10−2Ωcm2) and reflectivity (>76%) after long-term annealing at 150 °C in nitrogen ambient. According to the results of the secondary ion mass spectroscopy study, it is suggested that the Ni layer prevents the penetration of Ti into GaN during thermal treatment.
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Handbook of chemistry and physics
Journal of the Franklin Institute · 1930 · 11.7K citations
Isamu Akasaki Isamu Akasaki, Hiroshi Amano · Japanese Journal of Applied Physics · 1997 · 661 citations · Full text
Very low resistance multilayer Ohmic contact to <i>n</i>-GaN
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