Direct Chip Attachment (DCA) Packaging of a 2-D Thermal Flow Sensor

Concepts

EngineeringMechanical EngineeringHeat TransferSensorsThermal AnalysisChip PackagingFlow SensorsHeat FlowTemperature MeasurementThermal SensorsThermal SimulationFlow Sensor AccuracyFlow Sensor PackagingHeat Flux SensingThermal Flow SensorsThermal Sensor Validation

Abstract

The design and fabrication of a DCA packaged thermal flow sensor, as well as the simulation and test results were presented in this paper. The fabricated flow sensor was glued to the backside of PCB board with the adhesive, and wire bonded to front side of the PCB through a prefabricated hole, and then the chip was capsulated using thermal insulated resin on the front side. The test results matched well with the predicted value, with an error no more than 8%.

References

Micromachined flow sensors—a review

Nam‐Trung Nguyen · Flow Measurement and Instrumentation · 1997 · 386 citations

Engineering, Mechanical Engineering, Microelectromechanical Systems +11

Silicon thermal flow sensor with a two-dimensional direction sensitivity

B.W. van Oudheusden · Measurement Science and Technology · 1990 · 105 citations

Engineering, Mechanical Engineering, Heat Transfer +16

Silicon flow sensors

B.W. van Oudheusden · 1988 · 34 citations

Engineering, Mechanical Engineering, Heat Transfer +13

Flip-chip packaging for thermal CMOS anemometers

F. Mayer, Oliver Paul, H. Baltes · 2002 · 25 citations

Engineering, Electrical Engineering, Heat Transfer +16

Flow sensing with thermal sigma-delta modulators

Kofi A. A. Makinwa · Research Repository (Delft University of Technology) · 2004 · 19 citations · Full text

Engineering, Mechanical Engineering, Mechatronics Engineering +12