Carbon‐Nanotube Through‐Silicon Via Interconnects for Three‐Dimensional Integration

Abstract

Interconnection of carbon-nanotube (CNT)-filled through-silicon vias is demonstrated through an easy-to-implement process based on mechanical fastening. Direct CNT-to-CNT and CNT-to-Au contacts are realized at the microscale, and their specific contact resistances extracted from electrical measurements are approximately 1.2 × 10(-3) Ω cm(2) and 4.5 × 10(-4) Ω cm(2) , respectively.