Publication | Closed Access
A High Gain 600 GHz Amplifier TMIC Using 35 nm Metamorphic HEMT Technology
36
Citations
10
References
2012
Year
Unknown Venue
Electrical EngineeringTerahertz DevicesTerahertz TechnologyEngineeringRf SemiconductorHigh-frequency DeviceMillimeter Wave TechnologyElectronic EngineeringTotal Chip SizeMicrowave TransmissionCoplanar Circuit TopologyCoplanar TmicTerahertz NetworkHigh Gain 600MicroelectronicsMicrowave EngineeringSubmillimeter Wave Technology
In this paper, we are presenting two terahertz monolithic integrated circuits (TMICs) for use in next-generation radar and spectroscopy systems operating in the WR-1.5 waveguide band (500 - 750 GHz). Both amplifier circuits have been realized using a 35 nm InAlAs/InGaAs based metamorphic high electron mobility transistor (mHEMT) technology in combination with a benzocyclobutene (BCB) encapsulation to minimize the device parasitics. Furthermore, airbridge type transmission lines (ABTL) and grounded coplanar circuit topology (GCPW) were applied, leading to a compact chip size and excellent gain performance in the submillimeter-wave frequency regime beyond 500 GHz. A realized six-stage ABTL amplifier circuit demonstrated a small-signal gain of more than 20 dB between 502 and 516 GHz, while a six-stage grounded coplanar TMIC achieved a linear gain of 20.3 dB at 610 GHz and more than 18 dB over the bandwidth from 557 to 616 GHz. The total chip size of both submillimeter-wave amplifier circuits was only 0.15 mm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> .
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