Low temperature growth of ultrananocrystalline diamond

Abstract

Ultrananocrystalline diamond (UNCD) films were prepared by microwave plasma chemical vapor deposition using argon-rich Ar∕CH4 plasmas at substrate temperatures from ∼400 to 800°C. Different seeding processes were employed to enhance the initial nucleation density for UNCD growth to about 1011sites∕cm2. High-resolution transmission electron microscopy, near-edge x-ray absorption fine structure, visible and ultraviolet Raman spectroscopy, and scanning electron microscopy were used to study the bonding structure as a function of growth temperature. The results showed that the growth of UNCD films is much less dependent on substrate temperature than for hydrogen-based CH4∕H2 plasmas. UNCD with nearly the same nanoscale structure as those characteristic of high-temperature deposition can be grown at temperatures as low as 400°C with growth rates of about 0.2μm∕hr. The average grain size increased to about 8nm from 3 to 5nm that is characteristic of high-temperature growth, but the relative amounts of sp3 and sp2 bonding remained unchanged. These results suggest that the activation energy for UNCD growth is about 2–3Kcal∕mole compared with ∼28kcal∕mole for traditional growth chemistries, and that hydrogen plays an important role in the growth of UNCD films using hydrogen-poor plasmas.