Concepedia

The contraction from 295 K to 4 K of some solders, epoxies, and AGOT graphite

P. Seligmann, R. E. Sarwinski

Cryogenics · 1972 · 19 citations · 1 references

DOI

Concepts

References

1

Coefficients of Thermal Expansion of Solids at Low Temperatures. I. The Thermal Expansion of Copper from 15 to 300°K.

Thor Rubin, H. W. Altman, Herrick L. Johnston · Journal of the American Chemical Society · 1954 · 108 citations

, , +15