Transient Behavior during Electrodeposition onto a Metal Strip of High Ohmic Resistance

Abstract

Electrochemical deposition onto a thin metal strip of high resistance can result in a deposit of varying thickness along the strip if the electrode resistance is sufficiently large to cause a nonuniform reaction rate distribution. As deposition proceeds, the ohmic resistance of the strip decreases and thus transient behavior is observed. The transient thickening process is modeled by a one‐dimensional pseudo steady‐state method. The results illustrate how transient behavior during deposit growth depends upon the mass transfer, charge transfer, ohmic resistance, and geometric characteristics of the system. Conditions are discussed under which nonuniform deposits may be anticipated.