Applied Physics Express · 2010 · 55 citations · 18 references
Natural SciencesMaterials EngineeringMaterials ScienceElectronic MaterialsSemiconductor MaterialsThin FilmsMemory DevicesMemristive MaterialsOxide SemiconductorsSemiconductor Device MaterialsSemiconductor Thin FilmsThin Film Electrical PropertiesDielectric BreakdownEnduranceEndurance CharacteristicsFilamentary Switching MechanismsNonvolatile Memory MaterialsResistive SwitchingTemperature DependenceThermal Activation
We prepared resistive switching Al–AlOx multilayered junctions and observed considerably improved endurance properties. The mechanism of the observed resistance switching basically reflects the filament model. The temperature dependence of the transport in each resistance state revealed additional features, that is a well-defined thermal activation behavior in the high-resistance state is not observed in the layered device and the metallic conduction in the low-resistance state is not affected. The improved endurance properties are discussed in terms of the increased effective number of active regions, where the Reset and Set processes probably occur before a permanent dielectric breakdown.
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