Clad metals, roll bonding and their applications for SOFC interconnects - Concepedia

Concepedia

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Clad metals, roll bonding and their applications for SOFC interconnects

85

Citations

7

References

2005

Year

Li-Chun Chen, Zhenguo Yang, Bijendra Jha, Guanguang Xia, Jeffry W. Stevenson

Journal of Power Sources

Materials ScienceElectrical EngineeringEngineeringAdvanced Packaging (Semiconductors)Roll BondingMetallurgical InteractionElectronic PackagingMicroelectronicsInterface PropertyInterconnect (Integrated Circuits)Cladding (Metalworking)

References

	Year	Citations

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