Quantitative Modeling and Measurement of Copper Thin Film Adhesion

An improved technique for determining hardness and elastic modulus using load and displacement sensing indentation experiments

W. C. Oliver, George M. Pharr · Journal of materials research/Pratt's guide to venture capital sources · 1992 · 26.6K citations

Natural Sciences, Materials Engineering, Materials Science +16

Measurement of adherence of residually stressed thin films by indentation. I. Mechanics of interface delamination

D. B. Marshall, A.G. Evans · Journal of Applied Physics · 1984 · 457 citations

Natural Sciences, Materials Engineering, Materials Science +17

Growth and configurational stability of circular, buckling-driven film delaminations

John W. Hutchinson, M.D. Thouless, E. Liniger · Acta Metallurgica et Materialia · 1992 · 324 citations

Natural Sciences, Materials Engineering, Materials Science +12

On the toughness of ductile adhesive joints

Viggo Tvergaard, John W. Hutchinson · Journal of the Mechanics and Physics of Solids · 1996 · 253 citations

Engineering, Materials Engineering, Materials Science +12

Copper Transport in Thermal SiO2

Yosi Shacham‐Diamand, A. Dedhia, D. Hoffstetter et al. · Journal of The Electrochemical Society · 1993 · 241 citations

Engineering, Materials Engineering, Materials Science +17