Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 2008 · 12 citations · 1 references
EngineeringElectrical EngineeringMicroelectronicsMicrowave EngineeringSensorsDetector TechnologyHigh-frequency Semiconductor DevicesMicrowave Integrated CircuitsMicrowave Semiconductor DevicesRadio-frequency Integrated CircuitsSemiconductor DetectorsAluminaFlip-chip BondingMicrowave DevicesMicrowave RadiometryMicrowave SubstratesMonolithic Microwave Integrated CircuitsQuartzRadiometer Design
A W-band unamplified direct detection radiometer module is described that provides a wideband response and is scalable to large arrays. The radiometer design is intended to provide sufficient sensitivity for millimeter wave imaging applications with a goal of 2K noise equivalent temperature difference (NETD) at a 30 Hz frame rate. This effort leverages previously reported device scaling to increase sensitivity. We present a radiometer module designed for 60 GHz RF bandwidth that utilizes HRL's antimonide-based backward tunnel diode. An impedance matching circuit with on- and off-chip elements, as well as ridged waveguide, provides a wideband match to the detectors. Modules were designed with two different microwave substrates: 125 micron thick quartz and 100 micron thick alumina. flip-chip bonding of the detectors is amenable to automated pick-and-place for high volume manufacturing. The modular nature of the array approach allows large arrays to be manufactured in a straightforward manner. We present the design approach along with both electromagnetic simulations and measured performance of the modules. This work was supported by phase II of DARPA's MIATA program.
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Passive millimeter-wave imaging
L. Yujiri, Merit Shoucri, P. J. Moffa · IEEE Microwave Magazine · 2003 · 620 citations · Full text