Wetting Behaviors and Interfacial Reaction between Sn-10Sb-5Cu High Temperature Lead-free Solder and Cu Substrate - Concepedia

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Wetting Behaviors and Interfacial Reaction between Sn-10Sb-5Cu High Temperature Lead-free Solder and Cu Substrate

26

Citations

21

References

2010

Year

Q. L. Zeng, Jianjun Guo, Xiaolong Gu, Xinbing Zhao, Xiaogang Liu

Journal of Material Science and Technology

Materials ScienceMaterials EngineeringInterfacial ReactionCu SubstrateEngineeringCorrosionSurface ScienceApplied PhysicsMetallurgical InteractionMetallurgical ProcessElectronic PackagingMetal Processing

References

	Year	Citations

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