Publication | Closed Access
Investigation of interfacial reaction between Sn-Ag eutectic solder and Au/Ni/Cu/Ti thin film metallization
40
Citations
11
References
2001
Year
Materials ScienceMaterials EngineeringInterfacial ReactionEngineeringSurface ScienceApplied PhysicsMetallurgical InteractionMetallurgical ProcessSn-ag Eutectic SolderThin FilmsMetallurgical SystemMicrostructureMetal Processing
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