Silicon photonics for next generation system integration platform

TLDR

New semiconductor technologies such as many‑core processors and 3D memories are being researched to overcome the limitations of electronics in the near future. The study aims to demonstrate that silicon photonics can solve interconnection problems and that an optical interposer is the most efficient way to integrate photonics and electronics into a system‑integration platform. The authors develop this platform by addressing interconnection drawbacks, prototyping a hybrid interposer with advanced silicon photonic devices, and proposing a surface‑mounted component approach for broader market applicability. Early prototyping confirms successful integration of advanced silicon photonic devices into the hybrid interposer.

Abstract

New semiconductor technologies such as many-core processors and 3D memories are being researched in order to overcome the limitations of electronics in the near future. Here, we first discuss some drawbacks of current technologies, and then show that silicon photonics will solve those interconnection problems. Next, we describe our studies toward realizing a system integration platform based on photonics and electronics convergence, and show that an optical interposer is the most efficient way to cope with the various problems that a purely electronic system may encounter. Our recent advances in silicon photonic devices are also described, and their integration into the hybrid interposer is reported through an early prototyping result. Finally, a surface mounted components approach for silicon photonics technology is discussed, which may prove useful in the computer and communication markets.