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Thickness-direction coefficient of thermal expansion measurement of thin polymer films
46
Citations
13
References
1991
Year
EngineeringPolymer ProcessingThermal AnalysisPolymer CompositesElectronic PackagingPolymer ChemistryThin Film ProcessingMaterials ScienceKapton PolyimidePolymer AnalysisHeat TransferThermal Expansion MeasurementCte Anisotropy3D PrintingFlexible ElectronicsPolymer ScienceApplied PhysicsPolymer CharacterizationPolymer PropertyThin FilmsThermal SensorThermal EngineeringPolymer ModelingThermal PropertyThermal Expansion
A highly sensitive capacitance-change technique, suitable for thin polymer films, has been developed for the measurement of the coefficient of thermal expansion (CTE) in the film-thickness direction. Using this technique, we have determined the thickness-direction CTE of Kapton polyimide to be about 81±4 ppm/°C, averaged over the temperature range 50–150 °C. This polymer was chosen because it is widely used in the electronics industry for the fabrication of flexible printed circuits. Two other techniques, a Fabry–Perot laser interferometric technique, and the more conventional but less sensitive thermomechanical analysis, were also investigated. The thickness-direction CTEs obtained from the three techniques were at least a factor of 2.4 greater than the in-plane CTE of about 34±2 ppm/°C. The in-plane CTE, found here via simple length measurements, was in good agreement with literature values. It is speculated that the CTE anisotropy observed might be due to the in-plane molecular orientation of the polymer chains.
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