Local Characteristics of Convective Heat Transfer From Simulated Microelectronic Chips to Impinging Submerged Round Water Jets

HongGuang Sun, C. F., Wataru Nakayama

Journal of Electronic Packaging · 1993 · 65 citations · 0 references

Concepts

Abstract

An experimental study was performed to investigate the local characteristics of heat transfer from vertical simulated micro-chips to impinging submerged circular water jets. The effects of jet velocity, and nozzle-to-plate spacing were studied in the range of Re = 5.0 × 103 ˜ 3.6 × 104. Heat transfer rates at the stagnation point and local heat transfer distributions were correlated. Transition from laminar to turbulent flow was observed.