Publication | Open Access
Low-energy electron attachment to SF6. III. From thermal detachment to the electron affinity of SF6
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Citations
21
References
2007
Year
EngineeringDifferential Scanning CalorimetryElectron AffinityDetachment Rate CoefficientsExperimental ThermodynamicsComputational ChemistryChemistryThermal DetachmentElectron PhysicElectron SpectroscopyThermophysicsThermodynamicsThermoanalytical MethodChemical ThermodynamicsPhysicsAtomic PhysicsPhysical ChemistryThermal AttachmentNatural SciencesApplied PhysicsCondensed Matter PhysicsLow-energy Electron AttachmentChemical Kinetics
The thermal attachment of electrons to SF(6) is measured in a flowing-afterglow Langmuir-probe apparatus monitoring electron concentrations versus axial position in the flow tube. Temperatures between 300 and 670 K and pressures of the bath gas He in the range of 0.3-9 Torr are employed. Monitoring the concentrations of SF(6)(-) and SF(5)(-), the latter of which does not detach electrons under the applied conditions, an onset of thermal detachment and dissociation of SF(6) at temperatures above about 530 K is observed. Analysis of the mechanism allows one to deduce thermal detachment rate coefficients. Thermal dissociation rate coefficients for the reaction SF(6)(-)-->SF(5)(-)+F can only be estimated by unimolecular rate theory based on the results from Part I and II of this series. Under the applied conditions they are found to be smaller than detachment rate coefficients. Combining thermal attachment and detachment rates in a third-law analysis, employing calculated vibrational frequencies of SF(6) and SF(6)(-), leads to the electron affinity (EA) of SF(6)(-). The new value of EA=1.20(+/-0.05) eV is significantly higher than previous recommendations which were based on less direct methods.
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