Integration and interconnect techniques of planar and non-planar structures for microwave and millimeter-wave circuits - current status and future trend

Abstract

Hybrid integration techniques (HITs) of planar and non-planar structures are discussed for low-cost and high-performance millimeter-wave integrated circuits (ICs) and systems. Current status of this research topic is reviewed with emphasis on various integration/interconnect schemes of planar circuits and non-radiative dielectric (NRD) guides. Co-layered and aperture-coupling arrangements of planar circuits and NRD-guide are presented. Future trend is forecasted with emphasis on single substrate integration of planar and non-planar geometries. Substrate integrated circuits (SICs) are highlighted that can render the non-planar structures in planar form.