Hydrogen incorporation and embrittlement of electroformed Au, Cu and Au–Cu

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	Year	Citations
The Effect of Inclusions on the Ductility of Electroless Copper Deposits Y. Okinaka, H. K. Straschil Journal of The Electrochemical Society EngineeringChemistryChemical DepositionElectrometallurgyChemical Engineering	1986	55
The Effect of Hydrogen on the Ductility of Electrodeposited Ni‐P Amorphous Alloys Robert L. Zeller, Uziel Landau Journal of The Electrochemical Society Materials EngineeringMaterials ScienceCrack PropagationHigh Temperature MaterialsEngineering	1990	34
Effect of the Type of Substrates on the Ductility and Microstructure of Electroless Copper Deposits S. Nakahara, Cecilia Y. Mak, Y. Okinaka Journal of The Electrochemical Society EngineeringThin Film Process TechnologyElectrometallurgyChemical EngineeringElectroless Copper	1993	19

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