TLM modelling of the thermal behaviour of conducting films on insulating substrates

Abstract

A three-dimensional transmission line matrix (TLM) routine has been developed to model the effects of heat flow in structures comprising conducting metal films on insulating substrates. It is shown that the component of heat flow within the conductor itself is significant even for very thin layers of metal. The effects of thermal diffusivity are investigated within the millisecond time range and the implications for electrical fuse applications are discussed.