IBM Journal of Research and Development · 1969 · 78 citations · 1 references
Materials ScienceElectrical EngineeringDielectric ConstantEngineeringSurface ScienceApplied PhysicsSemiconductor MaterialThin Film Process TechnologyThin FilmsPulsed Laser DepositionChemical DepositionElectrical PropertyDielectric Constant κRf SputteringThin Film Processing
Two deposition parameters are important in rf sputtering of SrTiO <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</inf> films: the oxygen-argon content ratio, and the substrate temperature. More than 1% oxygen is needed to produce insulating films; the exact percentage required depends on system cleanliness. Both dielectric constant and crystallite size increase with increasing substrate temperature. Films of 2400 Å deposited at 500°C on gold have a dielectric constant of 200. The dc conductivity closely follows the Poole-Frenkel model. Two dielectric loss peaks are believed to be caused in part by an oxygen deficient region near one electrode. The variation in the dielectric constant κ with electric field is similar to that observed in bulk material.
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L. Young, H. A. Liebhafsky · Physics Today · 1962 · 910 citations
Materials Science, Materials Engineering, Material Analysis +6