Structural Analysis For Circuit Card Systems Subjected to Bending

Abstract

The determination of stress in a typical module/lead/card system is generally a very complex task. In the present paper a new engineering modeling approach is given, high-lighting simple, approximate calculations of the most significant system responses. Simplified patterns of plate action are construed using strips, including the module, in both x and y directions. Relationships were obtained for various shapes and sizes of card and module (e.g., square and rectangular); various systems of load and support conditions; various designs of modules (e.g., double-sided and stacked) and leads; clustered groups of modules, etc. The finite element method was used both to corroborate results of the theoretical approach, and to provide an “experimental” technique for the major response quantities.