An Automatic Inspection Method for the Fracture Conditions of Anisotropic Conductive Film in the TFT-LCD Assembly Process

Abstract

In this study an automatic optical inspection system is presented to evaluate the fracture and deformation status of conducting particles of anisotropic conductive film in the TFT-LCD assembly process. The amount of deformation and quantity of conducting particles in the test pattern can be automatically evaluated by image analysis. A specific operation is carried out in the image processing method, and the calculation of the image gradient operator is used to produce a preferable contrast between the processed particle image and the background. The thinning processing method is applied for information reduction and information creation. An amount of samples are taken with a target template for synchronous multiple-comparison, and the optimal threshold of the binary image is obtained. This study utilizes the assistance of image processing technology to inspect the fracture conditions of anisotropic conductive film in the TFT-LCD assembly process. This system can decrease the defection rate of products, obtain over 90% recognition accuracy even in noisy environments, and will be verified in an automatic production line.