Effects of rolling and sintering temperature on peel strength of bonding interfaces for Ag/Cu bimetallic strips

Abstract

AbstractCu/Ag bimetallic strips were prepared by roll bonding in the temperature range 293-873 K and sinter treating in the temperature range 523-1073 K. The interface peel strength was determined and the peeled surface morphology observed. High peel strength is obtained from the excellent metallurgical joint given by solute interdiffusion and matrix recrystallisation under sintering conditions 523-673 K for bimetallic strips rolled at ambient temperature. Sintering in the temperature range 873-1073 K results in reduced peel strength due to increased void formation at the interface, although some local contacts on the mated surface could melt and merge at 1073 K. Low peel strength due to poor metallurgical bonding is obtained if the bimetallic strips are roll bonded at temperatures lower than 623 K. The peel strength dramatically decreases due to the thick oxide layer present between the two strip surfaces when the bimetallic strips are roll bonded at excessively high temperatures.