Two-dimensional imaging of Debye-Scherrer ring for tri-axial stress analysis of industrial materials

Abstract

In this study, an application of the two-dimensional imaging technology to the X ray tri-axial stress analysis was studied. An image plate (IP) was used to obtain a Debye-Scherre ring and the image data was analized for determining stress. A new principle for stress analysis which is suitable to two-dimensional imaging data was used. For the verification of this two-dimensional imaging type X-ray stress measurement method, an experiment was conducted using a ferritic steel sample which was processed with a surface grinder. Tri-axial stress analysis was conducted to evaluate the sample. The conventional method for X-ray tri-axial stress analysis proposed by Dölle and Hauk was used to evaluate residual stress in order to compare with the present method. As a result, it was confirmed that a sufficiently highly precise and high-speed stress measurement was enabled with the two-dimensional imaging technology compared with the conventional method.