High productivity thermocompression flip chip bonding

Abstract

Thermocompression (TC) bonding is seen as the next-generation packaging technology that will enable faster and more energy efficient devices in the face of slowing cost-performance gains achievable by advancing wafer fabrication technology. TC bonding will enable higher I/O counts and finer pitch interconnections than traditional interconnect methods through better control of the stress and warpage between devices and the substrate. In combination with through-silicon-vias (TSVs), TC bonding allows advanced memory stacks, such as the Hybrid Memory Cube and Wide-I/O memory.