Applied Physics Letters · 2011 · 71 citations · 18 references
Natural SciencesMaterials SciencePhysicsCondensed Matter PhysicsMaterials PhysicsThin FilmsGrain-surface ChemistryMetalsSurface PhysicsThin Film Electrical PropertiesAc Impedance AnalysisConductionElectronic ConductionGrain Boundary AnalysisGrain Boundary ConductionGrain Boundary PhysicsOhmic ConductionTemperature Dependence
Mn 1.85 Co 0.3 Ni 0.85 O 4 thin films with single cubic spinel phase and compact surface were prepared by chemical solution deposition method on Al2O3 substrates. Temperature dependent ac impedance spectroscopy was employed to analyze the contributions of grain boundary (GB) and grain to the conduction mechanism. The major characteristics (hopping type, resistance versus temperature behavior, and characteristic temperature T0) of the GB and grain were obtained. The hopping type of GB is nearest-neighbor-hopping (NNH), and that of grain might be a transition from variable-range-hopping to NNH. The GB shows dominating resistance while the grain shows stronger temperature dependence.
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