Characterisation of reaction layers on copper surfaces formed in aqueous chloride and sulphate ion containing electrolytes

Abstract

Abstract Copper is in a passive state in a potential range of 50 mV H to about 300 mV H in contact with an aqueous electrolyte at neutral pH caused by the formation of a thin tarnishing layer consisting of copper(I)‐corrosion products. This layer inhibits more the anodic than the cathodic partial reaction of the corrosion process. The steep threshold in the transpassive range leads to the oxidation of copper and the formation of secondarily formed reaction layers. In sulphate containing electrolytes voluminous reaction layers of crystalline non‐protective copper(I)‐oxide are formed. The manifestation of corrosion is general attack. In chloride containing electrolytes a two‐fold reaction layer is formed, copper(I)‐chloride underneath copper(I)‐oxide. This amorphous copper(I)‐oxide is formed via hydrolysis of copper(I)‐chloride and inhibits anodic metal dissolution. The only observed manifestation of corrosion is repassivating pitting.