Plasma-enhanced chemical vapor deposition of β-tungsten, a metastable phase

Abstract

Plasma-enhanced chemical vapor deposition of a metastable phase of tungsten ( β-W) is performed using tungsten hexafluoride and hydrogen as source gases. At 350 °C, the as-deposited resistivity of these films is ∼50 μΩ cm. After heat treatments between 650 and 750 °C in forming gas, the resistivity drops below 11 μΩ cm. Concomitant with this resistivity change is a phase change to α-W, the equilibrium, body-centered-cubic form.