Characterization for graphene as heat spreader using thermal imaging method

Abstract

Monolayer graphene was synthesized through thermal chemical vapor deposition (TCVD) as heat spreader in electronic packaging. Platinum (Pt) was functioned as hot spot of thermal testing chip. The hot spot temperature of thermal testing chip bonded onto a heat sink measured by an FLIR infrared thermograph was decreased by about 5 °C from 52 °C to 47 °C when driven at a heat flux about 1280W/cm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> with a graphene heat spreader attached. It is conceivable that further improvements to the cooling performance of graphene heat spreader can be made by optimizing the synthesis parameters and transfer process.