Crack generation and the effect of in-process electro-discharge dressing in grinding single crystal MgO

Advanced mechanics of materials

Journal of the Franklin Institute · 1953 · 1.2K citations · Full text

Engineering, Materials Engineering, Materials Science +12

Mirror Surface Grinding of Silicon Wafers with Electrolytic In-Process Dressing

H. Ohmori, Tomoyuki Nakagawa · CIRP Annals · 1990 · 331 citations

Engineering, Manufacturing Engineering, Materials Engineering +16

The Effect of Deformation on the Contact Area in Grinding

W. Brian Rowe, Michael N. Morgan, H.S. Qi et al. · CIRP Annals · 1993 · 118 citations

Engineering, Materials Engineering, Materials Science +12

Advanced mechanics of materials

2003 · 106 citations

Engineering, Materials Engineering, Materials Science +12

On-Machine Trueing/Dressing of Metal Bond Grinding Wheels by Electro-Discharge Machining

Kiyoshi Suzuki, Taro Uematsu, Takeo Nakagawa · CIRP Annals · 1987 · 101 citations

Engineering, Manufacturing Engineering, Materials Engineering +8