Effect of Bismuth on Intermetallic Compound Growth in Lead Free Solder/Cu Microelectronic Interconnect - Concepedia

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Effect of Bismuth on Intermetallic Compound Growth in Lead Free Solder/Cu Microelectronic Interconnect

26

Citations

21

References

2011

Year

Tian You Kang, Y.Y. Xiu, Jianghua Wang, Weiping Tong, C.Z. Liu

Journal of Material Science and Technology

Materials ScienceElectrical EngineeringWafer Scale ProcessingEngineeringApplied PhysicsMetallurgical InteractionElectronic PackagingMicroelectronicsIntermetallic Compound GrowthInterconnect (Integrated Circuits)

References

	Year	Citations

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