Publication | Closed Access
Microstructure design and dissolution behavior between 2024 Al/Sn with the ultrasonic-associated soldering
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Citations
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References
2012
Year
Materials ScienceMaterials EngineeringEngineeringPowder MetallurgyApplied PhysicsAlloy DesignMetallurgical ProcessMicrostructure DesignDissolution BehaviorMicrostructureMetal ProcessingUltrasonic-associated Soldering
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