Filled Bolometer Arrays for Herschel/PACS

Abstract

Since 1997, CEA/DSM/DAPNIA/ Service d?Astrophysique in Saclay and CEA/DTA/LETI in Grenoble are developing filled Bolometer arrays sensitive in far infrared and submillimeter. These arrays are based on an all Silicon technology development, and are optimized for imaging in high photon background conditions. A 32 × 64 and a 16 × 32 pixels arrays are under development for the far infrared photometer in the PACS instrument, which is part of the Herschel payload. We present details of the design of these arrays. We describe the performance measurements obtained so far, and give some prospects for future application