Modeling and analysis of the material removal profile for free abrasive polishing with sub-aperture pad

Contact of nominally flat surfaces

J. A. Greenwood, J. B. P. Williamson · Proceedings of the Royal Society of London A Mathematical and Physical Sciences · 1966 · 5.5K citations

A micro-contact and wear model for chemical–mechanical polishing of silicon wafers

Yongwu Zhao, L. Chang · Wear · 2002 · 299 citations

Materials Science, Silicon Wafers, Engineering +7

Optimization of computer controlled polishing

Richard A. Jones · Applied Optics · 1977 · 250 citations

1/80-Wave Rms Departure, Engineering, Industrial Engineering +18

Effects of particle size, polishing pad and contact pressure in free abrasive polishing

Yongsong Xie, Bharat Bhushan · Wear · 1996 · 230 citations

Materials Science, Engineering, Corrosion +10

First-principles study of elastic properties of CeO₂, ThO₂and PoO₂

V. Kanchana, G. Vaitheeswaran, A. Svane et al. · Journal of Physics Condensed Matter · 2006 · 176 citations

Engineering, Firm Performance, Mechanical Engineering +16