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Anisotropic grain growth and crack propagation in eutectic microstructure under cyclic temperature annealing in flip-chip SnPb composite solder joints

Materials ScienceMaterials EngineeringCrack PropagationCyclic TemperatureEngineeringApplied PhysicsAnisotropic Grain GrowthMicrostructure-strength RelationshipElectronic PackagingThermomechanical ProcessingMechanics Of MaterialsMicrostructure